Coolaler.com community member "Toppc" scored an engineering sample of Intel's upcoming Core i7-4960X "Ivy Bridge-E" socket LGA2011 processor, and wasted no time in taking a peek inside its integrated heatspreader (IHS). Beneath the adhesive layer that holds the IHS to the package, which could be fairly easily cut through, "Toppc" discovered that Intel is using a strong epoxy/solder to fuse the processor's die to the IHS, and not a thermal paste, like on Core i7-3770K. Solders tend to have better conductivity than pastes, but make it extremely difficult to de-lid the processors, not to mention potentially disastrous. In the process of delidding this chip, "Toppc" appears to have knocked out a few components around the die. Unless you're good at precision soldering, something like that would be a fatal blow to your $1000 investment.
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