Kamis, 18 Juli 2013

techPowerUp!: Intel Issues PCN to Improve NUC Cooling

techPowerUp!
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Intel Issues PCN to Improve NUC Cooling
Jul 19th 2013, 04:20, by btarunr@techpowerup.com (btarunr)

Intel issued a product change notification (PCN), marked 112432-00, which attempts to improve the reliability of the system under heavy wireless network stress. A design flaw in Intel's reference NUC boxes equipped with wireless LAN and Thunderbolt came to light late last year, when a reviewer at TechReport discovered that when under stress, the mPCIe WLAN card can overheat, causing the neighboring mSATA SSD to malfunction. In its latest PCN, Intel included a 9.5 mm-thick flexible thermal pad on the top panel, which draws heat from the SSD, and conducts it to the chassis.


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